The effects of hydrogen bonds on the adhesion of inorganic oxide particles on hydrophilic Silicon surfaces,
X. Wu, E. Sacher et M. Meunier,
J. Appl. Physics, 86, 1744-1748 (1999).
Keywords :

Evaluation of a ceramic-polymer composite cation-selective membrane for sodium salt splitting,
F. Girard, R. Izquierdo, E. Quenneville, M. Paleologou, M. Meunier, D. Ivanov et A. Yelon,
Electrochemical Society, 146, 2919-2924 (1999).
Keywords : Sodium salt-splitting, Cation-selective membrane, Ceramic

Laser-enhanced gas phase surface modifications of Teflon AF1600 for increased Copper adhesion,
D. Popovici, M. Meunier et E. Sacher,
J. Adhesion, 70, 155-165 (1999).
Keywords : Adhesion, copper, fluoropolymer, excimer laser, X-ray damage

Excimer laser induced removal of particles from hydrophilic Silicon surfaces,
X. Wu, E. Sacher et M. Meunier,
J. Adhesion, 70, 167-178 (1999).
Keywords :

Electrical Properties of Annealed La0.5Sr0.5MnO3 Thin Films Prepared by Pulse Laser Deposition,
E. Quenneville, P. Decorse, M. Meunier, F. Morin and A., Yelon,
Electro Chem. Soc. Proc. 99-13, 218-227 (1999).
Keywords : Pulser laser deposition, thin films, lanthanum manganite, conductivity measurements

Novel Nasicon-Polymer Composite Membrane for Electrically Driven Processes. Effect of Ceramic thickness on Current Efficiency,
L. Cormier, F. Ma, S.T. Bah, S. Guétré, M. Meunier, M. Paleologou, and A. Yelon,
Electrochem. Soc. Proc. 99-13, 35-41 (1999).
Keywords : NASICON, Ceramic, Electrically driven processes, Current Efficiency

PROCEEDINGS

FMI applied to the study of the temperature distribution in flip chips,
N. Boyer, D. P. Masson, M. Meunier, M. Simard-Normandin,
Procedings of the Semi-Therm. XV Conf. (1999).
Keywords : fluorescent microthermal imaging, temperature distribution, microelectronics